DocumentCode :
1524200
Title :
New global insight in ultrathin oxide reliability using accurate experimental methodology and comprehensive database
Author :
Wu, Ernest ; Nowak, Edward ; Vayshenker, Alex ; McKenna, Jonathan ; Harmon, David ; Vollertsen, Rolf-Peter
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Volume :
1
Issue :
1
fYear :
2001
fDate :
3/1/2001 12:00:00 AM
Firstpage :
69
Lastpage :
80
Abstract :
In this paper, we critically examine several important experimental aspects concerning ultrathin oxide reliability. The statistical nature of breakdown measurements and the impact on data interpretation is discussed. Thickness dependence of Weibull slopes and its impact on reliability projection is reviewed. We also investigate the voltage-dependent voltage acceleration using two independent experimental methods over a wide range of oxide thickness values. Within the framework of a general defect generation model, we explore the possibility of a voltage-dependent defect generation rate to account for the increase in voltage acceleration with decreasing voltages. Using direct experimental results, we clarify that strong temperature dependence found on ultrathin oxides is a voltage effect, not a thickness effect as previously suggested, In the context of voltage-dependent voltage acceleration, we experimentally resolve various seemingly contradicting and confusing observations such as temperature-independent voltage acceleration and non-Arrhenius temperature dependence found on ultrathin oxides. Finally, we provide a global picture for time-to-breakdown in voltage and temperature domain constructed from two important empirical principles based on comprehensive experimental database
Keywords :
CMOS integrated circuits; Weibull distribution; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; semiconductor device breakdown; Weibull slopes; data interpretation; defect generation model; nonArrhenius temperature dependence; oxide thickness values; reliability projection; statistical breakdown measurements; temperature-independent voltage acceleration; time-to-breakdown; ultrathin oxide reliability; voltage-dependent voltage acceleration; Acceleration; Databases; Dielectric breakdown; Electric breakdown; Electron emission; Heating; Statistics; Stress; Temperature dependence; Voltage;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/7298.946461
Filename :
946461
Link To Document :
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