DocumentCode
1524200
Title
New global insight in ultrathin oxide reliability using accurate experimental methodology and comprehensive database
Author
Wu, Ernest ; Nowak, Edward ; Vayshenker, Alex ; McKenna, Jonathan ; Harmon, David ; Vollertsen, Rolf-Peter
Author_Institution
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Volume
1
Issue
1
fYear
2001
fDate
3/1/2001 12:00:00 AM
Firstpage
69
Lastpage
80
Abstract
In this paper, we critically examine several important experimental aspects concerning ultrathin oxide reliability. The statistical nature of breakdown measurements and the impact on data interpretation is discussed. Thickness dependence of Weibull slopes and its impact on reliability projection is reviewed. We also investigate the voltage-dependent voltage acceleration using two independent experimental methods over a wide range of oxide thickness values. Within the framework of a general defect generation model, we explore the possibility of a voltage-dependent defect generation rate to account for the increase in voltage acceleration with decreasing voltages. Using direct experimental results, we clarify that strong temperature dependence found on ultrathin oxides is a voltage effect, not a thickness effect as previously suggested, In the context of voltage-dependent voltage acceleration, we experimentally resolve various seemingly contradicting and confusing observations such as temperature-independent voltage acceleration and non-Arrhenius temperature dependence found on ultrathin oxides. Finally, we provide a global picture for time-to-breakdown in voltage and temperature domain constructed from two important empirical principles based on comprehensive experimental database
Keywords
CMOS integrated circuits; Weibull distribution; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; semiconductor device breakdown; Weibull slopes; data interpretation; defect generation model; nonArrhenius temperature dependence; oxide thickness values; reliability projection; statistical breakdown measurements; temperature-independent voltage acceleration; time-to-breakdown; ultrathin oxide reliability; voltage-dependent voltage acceleration; Acceleration; Databases; Dielectric breakdown; Electric breakdown; Electron emission; Heating; Statistics; Stress; Temperature dependence; Voltage;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/7298.946461
Filename
946461
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