Advancement of 3D printed conformal FSS and active array

Summary form only given. The size and shape requirements imposed on many electronics applications today require innovative fabrication methods to surpass the limits of conventional printed circuit board manufacturing techniques. Flexible electronics based on thin films such as polyimide or elastic substrates like PDMS have contributed to the emergence of non-planar substrates, as has the use of omnidirectional printing, which enables the direct writing of conductive traces using metal-based inks on surfaces of arbitrary shape. Not without as host of issues, these methods are vulnerable to stretches and cracks, and often feature lower conductivity than PCBs due to the difficulty of fully sintering ink particles on polymer substrates.