Title :
Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system
Author :
Liu, Weifeng ; Pecht, Michael G. ; Xie, Jingsong
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
fDate :
9/1/2001 12:00:00 AM
Abstract :
The use of very high I/O count electronic components, driven by higher performance and functionality requirements, has significantly impacted surface mount assembly yields. Metal particle-in-elastomer sockets were introduced to provide a solderless interconnection alternative with high I/O capability; easy assembly, rework, and maintenance; and the ability to upgrade components in the field. However as a new technology, elastomer sockets need to be assessed in terms of their reliability. A successful reliability assessment must be based on an understanding of the functional, performance, and life requirements; the environmental and operational life-cycle conditions; materials and design properties; and potential failure modes and mechanisms. This paper presents recent studies by the CALCE Electronic Products and Systems Center in characterizing the materials and design properties of a commercially available (Thomas and Betts) metal particle-in-elastomer interconnection system. These studies revealed the potential failure modes and mechanisms of this elastomer socket, and can be used to select suitable application parameters when using this socket. The results may also serve as a reference for technology insertion and evaluation of other elastomer interconnection systems
Keywords :
elastomers; electric connectors; interconnections; packaging; reliability; surface mount technology; LGA package; elastomer socket; electronic component; failure mechanism; life cycle; metal particle-in-elastomer interconnection; reliability; surface mount assembly; Assembly systems; Electronic components; Electronics packaging; Inorganic materials; Integrated circuit interconnections; Maintenance; Materials reliability; Mechanical factors; Sockets; Soldering;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.946501