Title :
A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
Author :
Cheng, Yu-Ting ; Lin, Liwei ; Najafi, Khalil
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
9/1/2001 12:00:00 AM
Abstract :
A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. Less than 0.2 MPa contact pressure with 46 mA current input for two parallel 3.5-μm-wide polysilicon on-chip microheaters can raise the temperature of the bonding region to 700°C bonding temperature and achieve a strong and reliable bond in 7.5 min. The formation of aluminum oxide with silicon precipitate composite layer is believed to be the source of the strong bond. Accelerated testing in an autoclave shows some packages survive more than 450 h under 3 atm, 100% RH and 128°C. Premature failure has been attributed to some unbonded regions on the failed samples. The bonding yield and reliability have been improved by increasing bonding time and applied pressure
Keywords :
aluminium; glass; life testing; micromechanical devices; packaging; reliability; silicon; 0.2 MPa; 128 C; 3 atm; 3.5 micron; 450 hour; 46 mA; 7.5 min; 700 C; Al; AlO-Si; Si; Si precipitate composite layer; accelerated testing; aluminum oxide formation; applied pressure; autoclave; bonding time; bonding yield; hermetic glass-Si package; localized Al/Si-glass bonding; polysilicon onchip microheaters; reliability; reliable bond; Aluminum; Bonding; Fabrication; Heating; Integrated circuit packaging; Integrated circuit reliability; Micromechanical devices; Protection; Silicon; Temperature;
Journal_Title :
Microelectromechanical Systems, Journal of
