DocumentCode :
1525335
Title :
Enhanced transmission line model structures for accurate resistance evaluation of small-size contacts and for more reliable fabrication
Author :
Sawdai, Donald ; Pavlidis, Dimitris ; Cui, Delong
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume :
46
Issue :
7
fYear :
1999
fDate :
7/1/1999 12:00:00 AM
Firstpage :
1302
Lastpage :
1311
Abstract :
Two new transmission line model (TLM) techniques are presented, The first structure, LT-TLM, provides very accurate determination of the transfer length LT (within 5%) and the contact resistivity ρC (within 12%) of lateral contacts, as compared to typical errors of 30% and 50%, respectively, for conventional TLM patterns, accurate determination of these quantities is important for the optimal design of small lateral contacts in high-performance devices, such as heterojunction bipolar transistors (HBTs). The second structure, a modified concentric TLM pattern, provides the same results as conventional TLM patterns; however, they do not require mesa isolation, and they can be fabricated extremely reliably. In contrast, conventional concentric TLM patterns are often shorted together or distorted by lift-off metallization processes. Both theoretical analysis and experimental verification with analysis of the accuracy of the extracted data is presented for each technique, demonstrating the advantages of these approaches
Keywords :
contact resistance; heterojunction bipolar transistors; ohmic contacts; semiconductor device metallisation; semiconductor device models; semiconductor device reliability; transmission line matrix methods; LT-TLM; concentric TLM patterns; contact resistivity; heterojunction bipolar transistors; lateral contacts; modified concentric TLM pattern; reliable fabrication; resistance evaluation; small-size contacts; transfer length; transmission line model structures; Conductivity; Contact resistance; Electrical resistance measurement; Fabrication; Heterojunction bipolar transistors; Metallization; Ohmic contacts; Semiconductor devices; Transmission line theory; Transmission lines;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.772468
Filename :
772468
Link To Document :
بازگشت