• DocumentCode
    1525584
  • Title

    Experimental and theoretical investigation of nonvolatile memory data-retention

  • Author

    De Salvo, Barbara ; Ghibaudo, Gérard ; Pananakakis, Georges ; Reimbold, Gilles ; Mondond, François ; Guillaumot, Bernard ; Candelier, Philippe

  • Author_Institution
    LPCS/ENSERG, Grenoble, France
  • Volume
    46
  • Issue
    7
  • fYear
    1999
  • fDate
    7/1/1999 12:00:00 AM
  • Firstpage
    1518
  • Lastpage
    1524
  • Abstract
    Data retention is one of the main issues affecting nonvolatile memory reliability due to the critical single-cell internal dimension scaling down. In this paper an extensive investigation of floating-gate memory charge retention is presented. We argue that the retention time, namely log(tR), varies linearly with temperature T rather than with 1/T as commonly assumed, yielding a drastic reduction in the extrapolated time-to-failure. The experimental evidence of the new “T Model” is proved by means of several experimental results. The physical consistency of the “T Model” is shown to reside in the temperature exponential behavior of the Fowler-Nordheim current. Indeed, a good physical modeling of both experimental current-temperature (J-T) and memory retention characteristics is achieved. Finally, it is shown that this new “T Model” reconciles seemingly controversial activation energy data from the literature
  • Keywords
    EPROM; integrated circuit modelling; integrated circuit reliability; integrated memory circuits; leakage currents; life testing; Fowler-Nordheim current; T model; activation energy data; current-temperature characteristics; extrapolated time-to-failure; floating-gate memory charge retention; memory cell retention time; memory reliability; memory retention characteristics; nonvolatile memory data-retention; physical modeling; single-cell internal dimension scaling down; temperature exponential behavior; Acceleration; Dielectric losses; EPROM; Extrapolation; Nonvolatile memory; Reliability theory; Semiconductor device reliability; Semiconductor memory; Temperature distribution; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.772505
  • Filename
    772505