Title :
2-D companding for noise reduction in strain imaging
Author :
Chaturvedi, Pawan ; Insana, Michael F. ; Hall, Timothy J.
Author_Institution :
Dept. of Radiol., Kansas Univ. Med. Center, Kansas City, KS, USA
Abstract :
Companding is a signal preprocessing technique for improving the precision of correlation-based time delay measurements. In strain imaging, companding is applied to warp 2-D or 3-D ultrasonic echo fields to improve coherence between data acquired before and after compression. It minimizes decorrelation errors, which are the dominant source of strain image noise. The word refers to a spatially variable signal scaling that compresses and expands waveforms acquired in an ultrasonic scan plane or volume. Temporal stretching by the applied strain is a single-scale (global), 1-D companding process that has been used successfully to reduce strain noise. This paper describes a two-scale (global and local), 2-D companding technique that is based on a sum-absolute-difference (SAD) algorithm for blood velocity estimation. Several experiments are presented that demonstrate improvements in target visibility for strain imaging. The results show that, if tissue motion can be confined to the scan plane of a linear array transducer, displacement variance can be reduced two orders of magnitude using 2-D local companding relative to temporal stretching.
Keywords :
acoustic correlation; acoustic noise; biomechanics; biomedical ultrasonics; blood flow measurement; compandors; strain measurement; ultrasonic imaging; 2D companding; blood velocity; correlation; data coherence; decorrelation error; displacement variance; linear array transducer; signal preprocessing; strain imaging noise; sum-absolute-difference algorithm; time delay measurement; tissue motion; ultrasonic echo field; Blood; Capacitive sensors; Coherence; Decorrelation; Delay effects; Image coding; Noise reduction; Time measurement; Ultrasonic imaging; Ultrasonic variables measurement;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on