DocumentCode :
1525937
Title :
Modeling Issues and Performance Analysis of High-Speed Interconnects Based on a Bundle of SWCNT
Author :
Giustiniani, Alessandro ; Tucci, Vincenzo ; Zamboni, Walter
Author_Institution :
Dipt. dell´´Ing. dell´´Inf. ed Ing. Elettr. (DIIIE), Univ. degli Studi di Salerno, Fisciano, Italy
Volume :
57
Issue :
8
fYear :
2010
Firstpage :
1978
Lastpage :
1986
Abstract :
The effects of the uncertainties associated with the transverse pattern of carbon nanotubes (CNTs) of the conducting type in a semiglobal interconnect based on a densely packed CNT bundle are investigated. The effectiveness of the insertion of a variable number of repeaters along the interconnect and the influence of the contact resistances between CNTs and external circuitry are also studied. The numerical computations are performed by using a multiconductor transmission line model in which the per-unit length parameters are accurately derived from a macroscopic fluidlike description of the conduction phenomena in CNTs.
Keywords :
carbon nanotubes; contact resistance; integrated circuit interconnections; multiconductor transmission lines; C; SWCNT; carbon nanotubes; contact resistances; dense packed CNT bundle; high-speed interconnect performance analysis; macroscopic fluidlike description; multiconductor transmission line model; Carbon nanotubes; Conductors; Electrons; Frequency; Integrated circuit interconnections; Performance analysis; Repeaters; Thermal conductivity; Uncertainty; Very large scale integration; CNT bundles; Carbon nanotubes (CNTs); high frequency; interconnects; nanotechnology; repeaters; single-walled CNT (SWCNT);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2050836
Filename :
5497133
Link To Document :
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