• DocumentCode
    152601
  • Title

    Silicon micromachined waveguide components at 0.75 to 1.1 THz

  • Author

    Reck, Theodore ; Jung-Kubiak, Cecile ; Leal-Sevillano, Carlos ; Chattopadhyay, Goutam

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2014
  • fDate
    14-19 Sept. 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Silicon micromachined waveguide components operating in the WM-250 (WR-1) waveguide band (0.75 to 1.1 THz) are measured. Through lines are used to characterize the waveguide loss with and without an oxide etch to reduce the surface roughness. A sidewall roughness of 100nm is achieved, enabling a waveguide loss of 0.2dB/mm. A 1THz band-pass filter is also measured to characterize the precision of fabrication process. A 1.8% shift in frequency is observed and can be accounted for by the 0.5deg etch angle and 2um expansion of the features by the oxide etch. The measured filter has a 13% 3dB bandwidth and 2.5dB insertion loss through the passband.
  • Keywords
    band-pass filters; etching; micromachining; production engineering computing; surface roughness; waveguides; WM-250 waveguide band; band-pass filter; fabrication process; frequency 0.75 THz to 1.1 THz; oxide etch; silicon micromachined waveguide components; surface roughness; waveguide loss characterization; Band-pass filters; Extraterrestrial measurements; Fabrication; Loss measurement; Receivers; Silicon; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
  • Conference_Location
    Tucson, AZ
  • Type

    conf

  • DOI
    10.1109/IRMMW-THz.2014.6956008
  • Filename
    6956008