Vertically Integrated Circuits at Fermilab

Author

Deptuch, Grzegorz W. ; Demarteau, Marcel ; Hoff, James R. ; Lipton, Ronald ; Shenai, Alpana ; Trimpl, Marcel ; Yarema, Raymond ; Zimmerman, Tom

Author_Institution

Electr. Eng. Dept., Fermi Nat. Accel. Lab., Batavia, IL, USA

Volume

57

Issue

4

fYear

2010

Firstpage

2178

Lastpage

2186

Abstract

The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.

Keywords

integrated circuit bonding; nuclear electronics; radiation detection; three-dimensional integrated circuits; 3D MPW run; 3D-IC technology; Fermilab; TSV; circuit thinning; fusion bonding techniques; radiation detection; through silicon vias; vertically integrated circuits; wafer thinning; 3D-IC technology; CMOS; TSV; integrated circuits; pixel detector; radiation imaging detectors; readout electronics; vertically integrated pixel readout device; wafer bonding;

fLanguage

English

Journal_Title

Nuclear Science, IEEE Transactions on

Publisher

ieee

ISSN

0018-9499

Type

jour

DOI

10.1109/TNS.2010.2049659

Filename

5497177