DocumentCode :
1526813
Title :
Strength and flexibility of bulk high-T/sub c/ superconductors
Author :
Goretta, K.C. ; Ming Jiang ; Kupperman, D.S. ; Lanagan, M.T. ; Singh, J.P. ; Vasanthamohan, N. ; Hinks, D.G. ; Mitchell, J.F. ; Richardson, J.W., Jr.
Author_Institution :
Div. of Energy Technol., Argonne Nat. Lab., IL, USA
Volume :
7
Issue :
2
fYear :
1997
fDate :
6/1/1997 12:00:00 AM
Firstpage :
1307
Lastpage :
1310
Abstract :
Strength, fracture toughness, and elastic modulus data for bulk high-temperature superconductors, commercial 99.9% Ag, and a 1.2 at.% Mg/Ag alloy have been collected. These data have been used to calculate fracture strains for bulk conductors. The calculations indicate that the superconducting cores of clad tapes should begin to fracture at strains below 0.2%. In addition, residual strains in Ag-clad (Bi,Pb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tapes have been measured by neutron diffraction. An explanation is offered for why many tapes appear to be able to tolerate large strains before exhibiting a reduction in current transport.
Keywords :
barium compounds; bismuth compounds; calcium compounds; composite superconductors; elastic moduli; fracture toughness; high-temperature superconductors; lead compounds; mechanical strength; neutron diffraction; silver; strontium compounds; superconducting tapes; thallium compounds; yttrium compounds; (BiPb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag; Ag; Ag-clad (Bi,Pb)/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tapes; Mg/Ag alloy; bulk high-T/sub c/ superconductors; clad tapes; current transport reduction; elastic modulus; flexibility; fracture strains; fracture toughness; high-temperature superconductors; neutron diffraction; residual strains; strength; superconducting cores; Capacitive sensors; Conducting materials; Diffraction; High temperature superconductors; Laboratories; Materials science and technology; Neutrons; Strain measurement; Superconductivity; Testing;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.620765
Filename :
620765
Link To Document :
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