DocumentCode :
1527515
Title :
Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs
Author :
Lin, Yeong-Her ; You, Jiun Pyng ; Lin, Yuan-Chang ; Tran, Nguyen T. ; Shi, Frank G.
Author_Institution :
Optoelectron. Packaging & Mater. Labs., Univ. of California, Irvine, Irvine, CA, USA
Volume :
33
Issue :
4
fYear :
2010
Firstpage :
761
Lastpage :
766
Abstract :
Silicone materials with a relatively high-refractive index have been introduced for the encapsulation of high-power light-emitting diodes (LEDs), and LEDs with relatively short wavelengths. However, most of those existing silicone encapsulants still suffer from thermal and radiation induced degradations and thus lead to reliability issues and a shorten lifetime. A new high-performance silicone has been developed and its performance is compared with other commercial silicone and optical grade epoxy in high-power white LEDs. The new materials had been found to suffer less loss in the lumen output during the aging test and high-temperature/high-humidity test, as well as the Joint Electron Devices Engineering Council (JEDEC) reliability test. It is concluded that this material is excellent for the packaging of high-power white LEDs and high-power colored LEDs, because of its ability in maintaining high-transparency and great radiation/thermal resistance.
Keywords :
encapsulation; light emitting diodes; refractive index; reliability; thermal resistance; aging test; high power light emitting diodes; high-humidity test; high-temperature test; optical grade epoxy; optical silicone; radiation induced degradation; refractive index; reliability test; silicone encapsulants; thermal resistance; Electron optics; Encapsulation; Joining materials; Light emitting diodes; Materials testing; Optical losses; Optical materials; Packaging; Thermal degradation; Thermal resistance; High-power LEDs; light-emitting diodes (LEDs); packaging; refractive index (RI); reliability; silicone; transmittance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2010.2046488
Filename :
5499035
Link To Document :
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