• DocumentCode
    1527515
  • Title

    Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs

  • Author

    Lin, Yeong-Her ; You, Jiun Pyng ; Lin, Yuan-Chang ; Tran, Nguyen T. ; Shi, Frank G.

  • Author_Institution
    Optoelectron. Packaging & Mater. Labs., Univ. of California, Irvine, Irvine, CA, USA
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    761
  • Lastpage
    766
  • Abstract
    Silicone materials with a relatively high-refractive index have been introduced for the encapsulation of high-power light-emitting diodes (LEDs), and LEDs with relatively short wavelengths. However, most of those existing silicone encapsulants still suffer from thermal and radiation induced degradations and thus lead to reliability issues and a shorten lifetime. A new high-performance silicone has been developed and its performance is compared with other commercial silicone and optical grade epoxy in high-power white LEDs. The new materials had been found to suffer less loss in the lumen output during the aging test and high-temperature/high-humidity test, as well as the Joint Electron Devices Engineering Council (JEDEC) reliability test. It is concluded that this material is excellent for the packaging of high-power white LEDs and high-power colored LEDs, because of its ability in maintaining high-transparency and great radiation/thermal resistance.
  • Keywords
    encapsulation; light emitting diodes; refractive index; reliability; thermal resistance; aging test; high power light emitting diodes; high-humidity test; high-temperature test; optical grade epoxy; optical silicone; radiation induced degradation; refractive index; reliability test; silicone encapsulants; thermal resistance; Electron optics; Encapsulation; Joining materials; Light emitting diodes; Materials testing; Optical losses; Optical materials; Packaging; Thermal degradation; Thermal resistance; High-power LEDs; light-emitting diodes (LEDs); packaging; refractive index (RI); reliability; silicone; transmittance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2010.2046488
  • Filename
    5499035