Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

Author

Shi, S.H. ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

141

Lastpage

151

Abstract

As one of the key requirements of the no-flow underfill materials for flip-chip applications, a proper self-fluxing agent must be incorporated in the developed no-flow underfill materials to provide proper fluxing activity during the simultaneous solder reflow and underfill material curing. However, most fluxing agents have some adverse effects on the no-flow underfill material properties and assembly reliability. In this paper, we have extensively investigated the effects of the concentration of the selected fluxing agent on the material properties, interconnect integrity and assembly reliability. Through this work, an optimum concentration window of the fluxing agent is obtained and a routine procedure of evaluating fluxing agents is established

Keywords

encapsulation; flip-chip devices; integrated circuit reliability; reflow soldering; assembly reliability; flip-chip applications; fluxing agent effects; interconnect integrity; material curing; no-flow underfill materials; solder reflow; Assembly; Corrosion; Curing; Electronics packaging; Integrated circuit technology; Material properties; Materials reliability; Materials science and technology; Temperature; Thermomechanical processes;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774718

Filename

774718