Title :
Development of reworkable underfills, materials, reliability and processing
Author :
Chane, L. ; Torres-Filho, Afranio ; Ober, Christopher K. ; Yang, Shu ; Chen, Jir-Shyr ; Johnson, R. Wayne
Author_Institution :
Loctite Corp., Rocky Hill, CT, USA
fDate :
6/1/1999 12:00:00 AM
Abstract :
The rework of packages is a standard practice in surface mount technology (SMT) assembly. The reasons for rework include process yields, failed parts, and field returns. The implementation of flipchip has been hindered by the lack of reworkability following underfill cure. Current commercial underfills do not allow for the rework of the flipchip. The development of a reworkable underfill is described in this paper. The materials selection process, information on the process for rework as well as pertinent reliability data are described
Keywords :
encapsulation; flip-chip devices; integrated circuit reliability; integrated circuit yield; surface mount technology; SMT; failed parts; field returns; materials selection process; process yields; reliability; reliability data; reworkable underfills; underfill cure; Assembly; Chip scale packaging; Cranes; Electronics packaging; Integrated circuit packaging; Materials reliability; Resins; Space technology; Surface-mount technology; Temperature;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.774724
