DocumentCode :
1527943
Title :
Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints
Author :
Constable, James H. ; Kache, Thomas ; Teichmann, Heiko ; Mühle, Sven ; Gaynes, Michael A.
Author_Institution :
State Univ. of New York, Binghamton, NY, USA
Volume :
22
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
191
Lastpage :
199
Abstract :
Four isotropically conducting adhesives were used to form lap joints between copper fingers which had been prepared with four surface metallizations (Cu, Au, Pd, and PdNi). A micromechanical tester was used to perform pull and fatigue tests on the 16 adhesive/finish combinations. The micro-ohm resistance change was measured during both the pull and fatigue tests. The similarities and differences between the mechanical strength, fatigue life, and resistance change for the 16 adhesive/finish combinations have been reported, and conclusions were made about relative motion between silver particles, and the fracture interfaces
Keywords :
adhesives; contact resistance; electric resistance measurement; fatigue testing; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; mechanical strength; Au; Cu; Pd; PdNi; electrical resistance monitoring; fatigue life; fatigue tests; fracture interfaces; isotropically conductive adhesive joints; lap joints; mechanical strength; micro-ohm resistance change; micromechanical tester; pull strength; pull tests; resistance change; surface metallizations; Copper; Electric resistance; Fatigue; Fingers; Gold; Metallization; Micromechanical devices; Monitoring; Surface resistance; Testing;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.774731
Filename :
774731
Link To Document :
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