Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

Author

Constable, James H. ; Kache, Thomas ; Teichmann, Heiko ; Mühle, Sven ; Gaynes, Michael A.

Author_Institution

State Univ. of New York, Binghamton, NY, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

191

Lastpage

199

Abstract

Four isotropically conducting adhesives were used to form lap joints between copper fingers which had been prepared with four surface metallizations (Cu, Au, Pd, and PdNi). A micromechanical tester was used to perform pull and fatigue tests on the 16 adhesive/finish combinations. The micro-ohm resistance change was measured during both the pull and fatigue tests. The similarities and differences between the mechanical strength, fatigue life, and resistance change for the 16 adhesive/finish combinations have been reported, and conclusions were made about relative motion between silver particles, and the fracture interfaces

Keywords

adhesives; contact resistance; electric resistance measurement; fatigue testing; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; mechanical strength; Au; Cu; Pd; PdNi; electrical resistance monitoring; fatigue life; fatigue tests; fracture interfaces; isotropically conductive adhesive joints; lap joints; mechanical strength; micro-ohm resistance change; micromechanical tester; pull strength; pull tests; resistance change; surface metallizations; Copper; Electric resistance; Fatigue; Fingers; Gold; Metallization; Micromechanical devices; Monitoring; Surface resistance; Testing;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774731

Filename

774731