Parametric dependence of fatigue of electronic adhesives

Adhesives used in electronic applications are subject to high cyclic shear stresses resulting from differential thermal expansion of the bonded materials. In this study, an attempt has been made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency. Both epoxies were used to bond surfaces of aluminum and silicon. Tensile lap-shear specimens were used