Chemical kinetic model of interfacial degradation of adhesive joints

Author

Lam, David C C ; Yang, Fan ; Tong, Pin

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Techno.l, Hong Kong

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

215

Lastpage

220

Abstract

Mechanical properties of adhesive joints are degraded in the presence of water. The progressive decrease in strength has been attributed to propagation of interfacial crack. Water diffusion and stress distribution within the adhesive joint as a function of time has been modeled using finite elements in this study. The stress history at the interface displayed spatially invariant characteristics similar to that of interfacial water concentration variation as a function of diffusion. The water-stress history along the interface can be modeled as a function dependent principally on water concentration without dependence on position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in literature

Keywords

adhesives; cracks; delamination; finite element analysis; packaging; reaction kinetics; reliability; solvation; adhesive joint; adhesive joints; chemical kinetic model; delamination; finite elements; interfacial crack propagation; interfacial degradation; joint strength degradation data; spatially invariant characteristics; stress distribution; water diffusion; water-stress history; Bonding; Chemicals; Compressive stress; Degradation; History; Kinetic theory; Moisture; Solvents; Tensile stress; Water;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774734

Filename

774734