DocumentCode

1527976

Title

Foreword Materials And Process Challenges-contributions From The First International Conference On Electronic Assembly

Author

Turbin, Laura J.

Author_Institution

Georgia Institute of Technology, Atlanta

Volume

20

Issue

3

fYear

1997

fDate

7/1/1997 12:00:00 AM

Firstpage

173

Lastpage

173

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/TCPMC.1997.649436

Filename

649436