DocumentCode :
1527980
Title :
Foreword thermal investigations of ICs and microstructures (THERMINIC)
Author :
Blackburn, D.L. ; Courtois, B.
Author_Institution :
NIST
Volume :
22
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
229
Lastpage :
230
Keywords :
Circuit simulation; Conferences; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; Microelectronics; Microstructure; Paper technology; Temperature; Testing;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.1999.774736
Filename :
774736
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1527980
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