• DocumentCode
    1527980
  • Title

    Foreword thermal investigations of ICs and microstructures (THERMINIC)

  • Author

    Blackburn, D.L. ; Courtois, B.

  • Author_Institution
    NIST
  • Volume
    22
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    229
  • Lastpage
    230
  • Keywords
    Circuit simulation; Conferences; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; Microelectronics; Microstructure; Paper technology; Temperature; Testing;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.1999.774736
  • Filename
    774736
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1527980