Solder paste print qualification using laser triangulation

Author

Lathrop, Richard R., Jr.

Author_Institution

Heraeus Cermalloy Inc., West Conshohocken, PA, USA

Volume

20

Issue

3

fYear

1997

fDate

7/1/1997 12:00:00 AM

Firstpage

174

Lastpage

182

Abstract

A method for determining the printability of a solder paste has been developed using laser triangulation based sensor hardware. The noncontact attribute of this measurement method is ideal for wet print measurements. The effect on material printability of both formulation and process elements are discussed. Results indicate that powder size has a definite and significant effect on the printability of the solder paste for 20 mil pitch applications. Bare board outer layer anomalies are characterized by surface scans and virtual cross sections

Keywords

automatic optical inspection; fine-pitch technology; measurement by laser beam; optical sensors; printed circuit testing; soldering; spatial variables measurement; surface mount technology; 20 mil; HASL anomalies; SMT; bare board outer layer anomalies; fine pitch applications; laser triangulation based sensor hardware; noncontact measurement method; powder size; process elements; solder paste print qualification; solder paste printability; surface scans; virtual cross sections; wet print measurements; Data acquisition; Image sensors; Laser beams; Materials testing; Microscopy; Optical materials; Optical scattering; Powders; Qualifications; Semiconductor laser arrays;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/3476.649437

Filename

649437