Title :
Solder paste print qualification using laser triangulation
Author :
Lathrop, Richard R., Jr.
Author_Institution :
Heraeus Cermalloy Inc., West Conshohocken, PA, USA
fDate :
7/1/1997 12:00:00 AM
Abstract :
A method for determining the printability of a solder paste has been developed using laser triangulation based sensor hardware. The noncontact attribute of this measurement method is ideal for wet print measurements. The effect on material printability of both formulation and process elements are discussed. Results indicate that powder size has a definite and significant effect on the printability of the solder paste for 20 mil pitch applications. Bare board outer layer anomalies are characterized by surface scans and virtual cross sections
Keywords :
automatic optical inspection; fine-pitch technology; measurement by laser beam; optical sensors; printed circuit testing; soldering; spatial variables measurement; surface mount technology; 20 mil; HASL anomalies; SMT; bare board outer layer anomalies; fine pitch applications; laser triangulation based sensor hardware; noncontact measurement method; powder size; process elements; solder paste print qualification; solder paste printability; surface scans; virtual cross sections; wet print measurements; Data acquisition; Image sensors; Laser beams; Materials testing; Microscopy; Optical materials; Optical scattering; Powders; Qualifications; Semiconductor laser arrays;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/3476.649437
