DocumentCode :
1528044
Title :
In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures
Author :
Kim, Yong-Jun ; Allen, Mark G.
Author_Institution :
Corp. R&D Center, Samsung Electron. Co. Ltd., Kyungki, South Korea
Volume :
22
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
282
Lastpage :
290
Abstract :
Two in situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh´s method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement. Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential. The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 10 8 cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored
Keywords :
Q-factor; adhesion; internal stresses; micromachining; polymer films; stress measurement; Au; Cu; Cu sacrificial layer; DuPont PI-2555; DuPont PI-2611; Q-factor; Rayleigh method; adhesion; in situ measurement; mechanical properties; micromachined resonant string structure; polyimide film; polyimide/metal bimorph; residual stress; resonant frequency; vibration; Adhesives; Degradation; Mechanical factors; Mechanical variables measurement; Micromachining; Polyimides; Residual stresses; Resonance; Resonant frequency; Stress measurement;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.774746
Filename :
774746
Link To Document :
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