DocumentCode :
1528069
Title :
Experiments on low velocity cooling of high conductivity substrates
Author :
Sikka, Kamal K. ; Torrance, Kenneth E. ; Fisher, Timothy S.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Volume :
22
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
307
Lastpage :
315
Abstract :
Experiments are reported on low velocity cooling of a heater-on-substrate geometry for high conductivity substrate materials. Four different substrate materials were studied: 1) aluminum 6061-T6; 2) aluminum nitride; 3) alumina; 4) FR-4. The effects of combined buoyancy and forced air flow, geometric orientation, substrate size, thermal conductivity, and emittance on heat transfer are evaluated. Results define the performance of the substrates and the limits of conjugate mixed convection for horizontal substrates, and of orientation effects for substrates tilted from buoyancy-opposing to buoyancy-assisting orientations. An analytical approximation is described that predicts the experimental data with good accuracy over broad parameter ranges
Keywords :
convection; cooling; substrates; thermal management (packaging); Al; Al2O3; AlN; FR-4; alumina; aluminum 6061-T6; aluminum nitride; buoyancy; conjugate mixed convection; electronic packaging; forced air flow; heat spreading; heat transfer; heater-on-substrate geometry; high conductivity substrate; low velocity cooling; Conducting materials; Electronics cooling; Electronics packaging; Fans; Geometry; Heat transfer; Heating; Substrates; Temperature; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.774750
Filename :
774750
Link To Document :
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