DocumentCode
152843
Title
Pulsed THz imaging for non-destructive testing of adhesive bonds
Author
Schmidhammer, U. ; Jeunesse, P.
Author_Institution
Lab. de Chim. Phys., Univ. Paris-Sud 11, Orsay, France
fYear
2014
fDate
14-19 Sept. 2014
Firstpage
1
Lastpage
2
Abstract
We demonstrate imaging with a single-shot THz Time Domain spectrometer for the rapid, but precise location and characterization of defects in an adhesive bond.
Keywords
adhesive bonding; nondestructive testing; spectrometers; terahertz wave imaging; adhesive bonds; nondestructive testing; pulsed THz imaging; single shot THz time domain spectrometer; Adhesives; Dielectrics; Plastics; Spatial resolution; Testing; Time-domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
Conference_Location
Tucson, AZ
Type
conf
DOI
10.1109/IRMMW-THz.2014.6956127
Filename
6956127
Link To Document