DocumentCode :
1529233
Title :
Testing the monster chip
Author :
Zorian, Yervant
Author_Institution :
LogicVision Inc., San Jose, CA, USA
Volume :
36
Issue :
7
fYear :
1999
fDate :
7/1/1999 12:00:00 AM
Firstpage :
54
Lastpage :
60
Abstract :
The market-driven electronics industry never slackens. Thanks to the swift advance of semiconductor technology, companies can and continually do introduce products with more functions, higher reliability, lower costs and at shorter intervals. ICs are considered the foundation of even traditionally nonelectronic products. So cheap are they, and so widely available, that whole industries now live off integrating ever more functions into ever smaller packages, even to creating entire systems-on-a-chip. This paper describes how such chips with 100 million transistors demand a new approach to testing-complementary embedded and external test
Keywords :
chip scale packaging; integrated circuit measurement; integrated circuit testing; IC testing approaches; embedded tests; external tests; large chip packages; market-driven electronics industry; monster chip testing; semiconductor technology; transistors; Assembly; Availability; Bandwidth; Integrated circuit testing; Life testing; Packaging; Partial response channels; Performance evaluation; Roads; Semiconductor device testing;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/6.774966
Filename :
774966
Link To Document :
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