Title :
Controlling the dopant incorporation in a-axis oriented Co doped YBCO thin films
Author :
Trajanovic, Z. ; Shreekala, R. ; Rajeswari, M. ; Takeuchi, I. ; Lobb, C.J. ; Venkatesan, T. ; Bauer, E. ; Bridges, F.
Author_Institution :
Dept. of Phys., Maryland Univ., College Park, MD, USA
fDate :
6/1/1997 12:00:00 AM
Abstract :
We studied the effects of Co doping on the intrinsic anisotropic properties of aligned a-axis YBa/sub 2/Cu/sub 3-x/Co/sub x/O/sub 7-/spl delta// films pulsed laser deposited on (100) LaSrGaO/sub 4/ substrates We used X-ray-absorption fine structure analysis and resistivity data to determine the quality of Co incorporation. Higher deposition pressures provided with better Co dopant incorporation but smaller grain size. However at lower pressures Co incorporation can still be achieved by down the cooling process. For transport along the c-direction, Co dopant causes reduction interlayer coupling as evidenced by an increase resistive anisotropy (/spl rho//sub c///spl rho//sub b/) with increasing level of Co incorporation, Co doping level of x=0.22 effectively doubles the resistive anisotropy of YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// films (from -18 to -40 at 100 K).
Keywords :
EXAFS; barium compounds; cobalt; doping profiles; grain size; high-temperature superconductors; pulsed laser deposition; superconducting thin films; yttrium compounds; 100 K; LaSrGaO/sub 4/; X-ray-absorption fine structure analysis; YBa/sub 2/(CuCo)/sub 3/O/sub 7/; YBa/sub 2/Cu/sub 3-x/Co/sub x/O/sub 7-/spl delta// films; a-axis oriented Co doped YBCO thin films; better Co dopant incorporation; deposition pressures; dopant incorporation; high temperature superconductor; intrinsic anisotropic properties; pulsed laser deposited film; reduction interlayer coupling; smaller grain size; Anisotropic magnetoresistance; Conductivity; Doping; High temperature superconductors; Optical pulses; Physics; Pulsed laser deposition; Superconducting films; Transistors; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on