DocumentCode
1529915
Title
Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission
Author
Song, Jeong Hwan ; Rensing, Marc ; Daunt, Chris L L M ; O´Brien, Peter ; Peters, Frank H.
Author_Institution
Integrated Photonics Group, Tyndall Nat. Inst., Cork, Ireland
Volume
1
Issue
6
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
975
Lastpage
980
Abstract
A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3- distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50°C without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production.
Keywords
heat sinks; impedance matching; microlenses; microstrip lines; optical couplers; optical isolators; optical modulation; packaging; semiconductor lasers; Kovar heat sink; L-shaped microstrip line; V-connector; butterfly package; directly modulated laser diode module; distributed feedback laser; integrated impedance matching resistor; microlens; module packaging process; optical coupling system; optical isolator; Lasers; Lenses; Optical coupling; Optical feedback; Packaging; Resistors; Wires; Impedance matching; microstrip line; optical coupling; optoelectronic module; photonics packaging;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2011.2129572
Filename
5779714
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