DocumentCode :
1530016
Title :
Thermal activation effects in CoCrPtTa media due to stacking faults
Author :
Holloway, L. ; Laidler, H.
Author_Institution :
Dept. of Phys., York Univ., UK
Volume :
37
Issue :
4
fYear :
2001
fDate :
7/1/2001 12:00:00 AM
Firstpage :
1459
Lastpage :
1461
Abstract :
We report magnetic measurements made on two CoCrPtTa thin film media, which were sputter deposited in identical conditions onto either CrMn or NiAl/CrMn underlayers grown on glass substrates. This produced films with [112¯0] and [101¯0] preferred orientations respectively. The films had stacking fault densities of 8±1% and 13±1% respectively. Increased magnetic viscosity and switching at low fields in the switching field distributions were observed which correlates well with the level of FCC-like regions. We find that the energy barriers to reversal in these films are dominated by the anisotropy field distribution rather than the distribution of grain-sizes. Furthermore, it is clear that even relatively low levels of stacking faults cause significant levels of thermally activated magnetization reversal which may cause reduced thermal stability of written information
Keywords :
chromium alloys; cobalt alloys; ferromagnetic materials; magnetic aftereffect; magnetic anisotropy; magnetic recording; magnetic thin films; magnetisation reversal; platinum alloys; remanence; sputtered coatings; stacking faults; tantalum alloys; thermal stability; CoCrPtTa; anisotropy field distribution; energy barriers to reversal; low fields; magnetic switching; magnetic viscosity; reduced thermal stability; remanence; sputter deposited; stacking faults; switching field distributions; thermal activation effects; thermally activated magnetization reversal; thin film media; written information; Glass; Magnetic anisotropy; Magnetic films; Magnetic switching; Magnetic variables measurement; Perpendicular magnetic anisotropy; Sputtering; Stacking; Substrates; Viscosity;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.950870
Filename :
950870
Link To Document :
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