Title :
Efficient SPICE-compatible electromagnetic model of arbitrarily shaped integrated passive structure
Author :
Milsom, Robert F.
Author_Institution :
Philips Res. Labs., Redhill, UK
fDate :
7/1/1999 12:00:00 AM
Abstract :
A numerically efficient SPICE-compatible electromagnetic model of an arbitrarily shaped integrated passive structure is presented. It is suitable for modeling structures with electrically small, but geometrically complex features. The original model, developed for printed circuit board layout simulation, is shown to be inadequate for integrated circuits, and also not directly usable for time-domain analysis. Here, it is adapted for structures fabricated in a silicon passive-integration process, and then extended to allow nonlinear time-domain analysis of active multichip modules that employ this technology as the substrate. Special emphasis is placed on characterizing losses. Comparison with measurement shows that the model is accurate
Keywords :
SPICE; UHF integrated circuits; boundary-elements methods; dielectric losses; eddy current losses; electromagnetism; equivalent circuits; integrated circuit modelling; losses; monolithic integrated circuits; multichip modules; silicon; time-domain analysis; BEM; MCM substrate; SPICE-compatible EM model; Si; Si passive-integration process; active multichip modules; arbitrarily shaped passive structure; conductor losses; electrically small features; electromagnetic model; geometrically complex features; integrated circuits; integrated passive structure; losses characterization; nonlinear time-domain analysis; numerically efficient model; Analytical models; Circuit simulation; Electromagnetic modeling; Integrated circuit layout; Integrated circuit modeling; Multichip modules; Printed circuits; Silicon; Solid modeling; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
