DocumentCode :
1531647
Title :
10-Gbps, 5.3-mW Optical Transmitter and Receiver Circuits in 40-nm CMOS
Author :
Liu, Frankie Y. ; Patil, Dinesh ; Lexau, Jon ; Amberg, Philip ; Dayringer, Michael ; Gainsley, Jon ; Moghadam, Hesam Fathi ; Zheng, Xuezhe ; Cunningham, John E. ; Krishnamoorthy, Ashok V. ; Alon, Elad ; Ho, Ron
Author_Institution :
Oracle Labs., Redwood Shores, CA, USA
Volume :
47
Issue :
9
fYear :
2012
Firstpage :
2049
Lastpage :
2067
Abstract :
We describe transmitter and receiver circuits for a 10-Gbps single-ended optical link in a 40-nm CMOS technology. The circuits are bonded using low-parasitic micro-solder bumps to silicon photonic devices on a 130-nm SOI platform. The transmitter drives oval resonant ring modulators with a 2-V swing and employs static thermal tuners to compensate for optical device process variations. The receiver is based on a transimpedance amplifier (TIA) with 4-kΩ gain and designed for an input power of - 15 dBm, a photodiode responsivity of 0.7 A/W, and an input extinction ratio of 6 dB. It employs a pair of interleaved clocked sense-amplifiers for voltage slicing and uses a DLL with phase adjustment for centering the clock in the data eye. Periodic calibration allows for adjustment of both voltage and timing margins. At 10 Gbps, the transmitter extinction ratio exceeds 7 dB and, excluding thermal tuning and laser power, it consumes 1.35 mW. At the same datarate, the receiver consumes 3.95 mW. On-chip PRBS generators and checkers with 231-1 sequences confirm operation at a BER better than 10-12.
Keywords :
CMOS integrated circuits; calibration; circuit tuning; clocks; digital phase locked loops; elemental semiconductors; error statistics; integrated circuit bonding; integrated optics; integrated optoelectronics; modulators; operational amplifiers; optical links; optical receivers; optical transmitters; photodiodes; silicon; silicon-on-insulator; soldering; BER; CMOS technology; DLL; SOI platform; Si; TIA; bit rate 10 Gbit/s; bonding; calibration; gain 6 dB; input extinction ratio; interleaved clocked sense-amplifier; laser power; low-parasitic microsolder bump; on-chip PRBS checker; on-chip PRBS generator; optical device process variation; optical receiver circuit; optical transmitter circuit; oval resonant ring modulator; phase adjustment; photodiode responsivity; power 1.35 mW; power 3.95 mW; power 5.3 mW; resistance 4 kohm; silicon photonic device; single-ended optical link; size 130 nm; size 40 nm; static thermal tuner; transimpedance amplifier; voltage 2 V; voltage slicing; CMOS integrated circuits; Modulation; Optical receivers; Optical ring resonators; Optical transmitters; Optical waveguides; Analog circuits; electrooptic modulators; feedback circuits; hybrid integrated circuits; optical receivers; thermal noise;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2012.2197234
Filename :
6211454
Link To Document :
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