MMW Antenna in IPD Process for 60-GHz WPAN Applications

Author

Huang, Fu-Jhuan ; Lee, Chien-Ming ; Kuo, Chueh-Yu ; Luo, Ching-Hsing

Author_Institution

Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

Volume

10

fYear

2011

fDate

7/3/1905 12:00:00 AM

Firstpage

565

Lastpage

568

Abstract

This letter presents an on-chip millimeter-wave (MMW) Yagi-Uda antenna implemented by the integrated passive device (IPD) process. This antenna consists of a half-wavelength dipole element and two director elements to achieve higher directivity than conventional wire dipole antennas and is excited using a micro-strip via-hole balun structure. Measurements indicate that the on-chip antenna achieves the bandwidth of 18% (53.8-64.8 GHz), a peak gain of 6 dBi. The simulated front-to-back ratio and radiation efficiency are 15 dB and 93%, respectively. Compared to the CMOS process, the characteristics of the designed antenna are much better. Thus, this 60-GHz chip antenna obtains a compact size of 1.5 × 1.8 mm², high efficiency, and high-gain advantages.

Keywords

CMOS integrated circuits; Yagi antenna arrays; baluns; dipole antennas; microstrip antennas; millimetre wave antennas; personal area networks; CMOS process; IPD process; MMW antenna; WPAN; Yagi-Uda antenna; balun structure; chip antenna; dipole antennas; frequency 60 GHz; front-to-back ratio; integrated passive device; microstrip antennas; millimeter wave antenna; Antenna measurements; Antenna radiation patterns; Dipole antennas; Gain measurement; Semiconductor device measurement; System-on-a-chip; 60 GHz; Yagi–Uda antenna; integrated passive device (IPD); wireless personal area network (WPAN);

fLanguage

English

Journal_Title

Antennas and Wireless Propagation Letters, IEEE

Publisher

ieee

ISSN

1536-1225

Type

jour

DOI

10.1109/LAWP.2011.2158379

Filename

5783291