DocumentCode :
1532827
Title :
Enhanced heterostructure field effect transistor CAD model suitable for simulation of mixed mode circuits
Author :
Ytterdal, Trond ; Fjeldly, Tor A. ; Shur, Michael S. ; Baier, Steven M. ; Lucero, R.
Author_Institution :
Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
Volume :
46
Issue :
8
fYear :
1999
fDate :
8/1/1999 12:00:00 AM
Firstpage :
1577
Lastpage :
1588
Abstract :
We describe a new enhanced model for deep submicron heterostructure field effect transistors (HFET´s) suitable for implementation in computer aided design (CAD) software packages such as SPICE. The model accurately reproduces both above-threshold and subthreshold characteristics of both n- and p-channel deep submicron HFET´s over the temperature range 250-450 K. The current-voltage (I-V) characteristics are described by a single, continuous, analytical expression for all regimes of operation, thereby improving convergence. The physics-based model includes effects such as velocity saturation in the channel, drain-induced barrier lowering (DIBL), finite output conductance in saturation, frequency dispersion, and temperature dependence. The output resistance and the transconductance are accurately reproduced, making the model suitable for simulation of mixed mode (digital/analog) circuits. The model has been extensively verified against experimental data for two HFET technologies with gate lengths down to 0.3 μm
Keywords :
SPICE; circuit CAD; circuit simulation; field effect integrated circuits; integrated circuit design; integrated circuit modelling; mixed analogue-digital integrated circuits; 0.3 micron; 250 to 450 K; CAD model; CAD software packages; I-V characteristics; SPICE; above-threshold characteristics; circuit simulation; deep submicron FETs; drain-induced barrier lowering; finite output conductance; frequency dispersion; gate lengths; heterostructure field effect transistor; mixed mode circuits; output resistance; physics-based model; subthreshold characteristics; temperature dependence; transconductance; velocity saturation; Convergence; Design automation; Dispersion; Frequency; HEMTs; MODFETs; SPICE; Software design; Software packages; Temperature distribution;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.777144
Filename :
777144
Link To Document :
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