• DocumentCode
    1532834
  • Title

    Noise parameter optimization of UHV/CVD SiGe HBT´s for RF and microwave applications

  • Author

    Niu, Guofu ; Ansley, William E. ; Zhang, Shiming ; Cressler, John D. ; Webster, Charles S. ; Groves, Robert A.

  • Author_Institution
    Dept. of Electr. Eng., Auburn Univ., AL, USA
  • Volume
    46
  • Issue
    8
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    1589
  • Lastpage
    1598
  • Abstract
    This paper demonstrates a predictive noise parameter estimation methodology for UHV/CVD SiGe HBT´s which combines ac measurement, calibrated ac simulation and two of the latest Y-parameter-based noise models: (1) the thermodynamic noise model, and (2) the SPICE noise model. The bias current and frequency dependence of the minimum noise figure, the optimum generator admittance, and the noise resistance are calculated using both models and compared with measurements. The observed agreements and discrepancies are investigated using circuit analysis of the chain noisy two-port representation. For the devices under study, the SPICE model description of thermal noise produces a better overall agreement to data in terms of all the noise parameters. Experiments on devices with different collector doping levels show that both low noise and high breakdown voltage can be realized with one profile without significantly compromising the ac current gain and the ac power gain
  • Keywords
    Ge-Si alloys; SPICE; UHF bipolar transistors; chemical vapour deposition; heterojunction bipolar transistors; microwave bipolar transistors; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; semiconductor device noise; semiconductor growth; semiconductor materials; HBT; RF applications; SPICE noise model; SiGe; UHV/CVD; Y-parameter-based noise models; ac measurement; bias current; breakdown voltage; calibrated ac simulation; chain noisy two-port representation; collector doping levels; frequency dependence; generator admittance; microwave applications; noise parameter optimization; noise resistance; thermodynamic noise model; Circuit noise; Electrical resistance measurement; Germanium silicon alloys; Noise figure; Noise measurement; Parameter estimation; Predictive models; Radio frequency; SPICE; Silicon germanium;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.777145
  • Filename
    777145