Title :
A 3-D Force and Moment Motor for Small-Scale Biomechanics Experiments
Author :
Sim, Jae Hoon ; Puria, Sunil
Author_Institution :
Stanford Univ., Stanford, CA, USA
Abstract :
The inability to identify 3-D force and moment components for actuators and sensors is a major limiting factor in the study of 3-D force interactions with small-scale biological structures. While recent advances have been made in the measurement of stimulating forces using load cells and atomic-force microscopy in experimental preparations of biological structures such as mammalian temporal bones, these techniques have mostly been limited to one or two dimensions. In this paper, a method is described for stimulating biological structures using a small magnet (2 mg Sm2Co17 ) and a nearby current-conducting coil (46 gauge, 50 turns), that allows the 3-D Lorentz forces and moments acting on the magnet to be calculated. To make these calculations possible, the dimensions and placements of the magnet and coil are accurately determined (within 10 mum for in vitro preparations) using high-resolution micro-CT imaging. This noncontact force motor method has been used to study the mechanics of the malleus-incus complex in the mammalian middle ear in addition to basilar membrane mechanics and fluid flow inside the cochlea, and it can also be applied to the study of other biomechanical structures.
Keywords :
biomechanics; biomembranes; computerised tomography; ear; 3D Lorentz forces; basilar membrane mechanics; biological structures; cochlea; current-conducting coil; fluid flow; high-resolution micro-CT imaging; magnet; malleus-incus complex; mammalian middle ear; microcomputerized tomography; moment motor; noncontact force motor method; small-scale biomechanics experiments; Actuators; Atomic force microscopy; Atomic measurements; Biomechanics; Biosensors; Bones; Cells (biology); Coils; Force measurement; Force sensors; Cochlea; coil; electromagnetic; force; magnet; micro-computed tomography (micro-CT); middle ear; moment;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2009.2030879