• DocumentCode
    1533757
  • Title

    Optimization of high-speed multistation SMT placement machines using evolutionary algorithms

  • Author

    Wang, Weihsin ; Nelson, Peter C. ; Tirpak, Thomas M.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
  • Volume
    22
  • Issue
    2
  • fYear
    1999
  • fDate
    4/1/1999 12:00:00 AM
  • Firstpage
    137
  • Lastpage
    146
  • Abstract
    Surface mount technology (SMT) is a robust methodology that has been widely used in the past decade to produce circuit boards. Analyses of the SMT assembly line have shown that the automated placement machine is often the bottleneck, regardless of the arrangement of these machines (parallel or sequential) in the assembly line. Improving and automating the placement machine is a key issue for increasing SMT production line throughput. This paper presents experimental results using genetic algorithms to optimize the feeder slot assignment problem for a high-speed parallel, multistation SMT placement machine. Four crossover operators, four selection methods, and two probability settings are used in our experiments. A penalty function is used to handle constraints. A comparison of genetic algorithms with several other optimization methods (human experts, vendor supplied software, expert systems, and local search) is presented, which supports the use of genetic algorithms for this problem
  • Keywords
    assembling; genetic algorithms; printed circuit manufacture; surface mount technology; assembly line; automated placement machine; circuit boards; crossover operators; evolutionary algorithms; feeder slot assignment problem; genetic algorithms; local search; multistation SMT placement machines; penalty function; probability settings; production line throughput; Assembly; Genetic algorithms; Humans; Optimization methods; Printed circuits; Production; Robustness; Software systems; Surface-mount technology; Throughput;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/6104.778173
  • Filename
    778173