Three-dimensional inspection of ball grid array using laser vision system

Author

Kim, Pyunghyun ; Rhee, Sehun

Author_Institution

Dept. of Mech. Eng., Hanyang Univ., Seoul, South Korea

Volume

22

Issue

2

fYear

1999

fDate

4/1/1999 12:00:00 AM

Firstpage

151

Lastpage

155

Abstract

An inspection process of the ball grid array (BGA) is proposed using a laser vision system which provides range image. This study suggests an inspection algorithm using the range images for evaluating the height of the solder ball, coplanarity and lead pitch, which are major factors in the BGA surface mounting technology. A feature-based algorithm was used in implementing region segmentation of range images. By deciding the BGA orientation using plane modeling, the errors of the range finding system were compensated and the reference of the height of the solder ball was found. Also, a method for measuring the height of the solder ball using free-form surface modeling was proposed. And, from the measured heights, the pitches and coplanarity were calculated

Keywords

ball grid arrays; computer vision; image segmentation; inspection; measurement by laser beam; surface mount technology; ball grid array; coplanarity; feature-based algorithm; laser vision system; lead pitch; plane model; range image region segmentation; solder ball height; surface model; surface mounting technology; three-dimensional inspection; Electronics packaging; Image processing; Image sensors; Inspection; Integrated circuit measurements; Laser modes; Lead; Machine vision; Semiconductor device measurement; X-ray imaging;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.778175

Filename

778175