Smart integration and packaging of 2D VCSEL´s for high-speed parallel links

Author

Kosaka, Hideo

Author_Institution

NEC Opto-Electron. Res. Labs., Ibaraki, Japan

Volume

5

Issue

2

fYear

1999

Firstpage

184

Lastpage

192

Abstract

This paper reviews recent progress in the integration and packaging of two-dimensional (2D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL´s with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined

Keywords

integrated circuit packaging; integrated optoelectronics; modules; optical interconnections; photothyristors; phototransistors; semiconductor laser arrays; surface emitting lasers; 2D VCSEL; 2D VCSEL module; VCSEL-thyristor; address switching functions; crossbar interconnections; distributed fiber switch; double-cavity phototransistor; high-density parallel links; high-speed parallel links; hyper-parallel transmission; image fiber; latching functions; optical interconnections; packaging; reviews; self-alignment-packaging technologies; smart integration; system applications; Fiber lasers; Optical arrays; Optical fiber devices; Optical fiber polarization; Optical interconnections; Packaging; Semiconductor laser arrays; Surface emitting lasers; Two dimensional displays; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/2944.778281

Filename

778281