Design and construction of an optoelectronic crossbar switch containing a terabit per second free-space optical interconnect

Author

Walker, Andrew C. ; Desmulliez, Marc P Y ; Forbes, Mark G. ; Fancey, Stuart J. ; Buller, Gerald S. ; Taghizadeh, Mohammad R. ; Dines, Julian A B ; Stanley, C.R. ; Pennelli, Giovanni ; Boyd, Adam R. ; Horan, Paul ; Byrne, Declan ; Hegarty, John ; Eitel, Sv

Author_Institution

Dept. of Phys., Heriot-Watt Univ., Edinburgh, UK

Volume

5

Issue

2

fYear

1999

Firstpage

236

Lastpage

249

Abstract

The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby InGaAs-based detectors and modulators are flip-chip bonded onto silicon integrated circuits. The system aims to demonstrate a 1-Tb/s aggregate data input/output to a single chip by means of free-space optics

Keywords

III-V semiconductors; electro-optical modulation; electro-optical switches; flip-chip devices; gallium arsenide; indium compounds; integrated optoelectronics; optical design techniques; optical fabrication; optical interconnections; photodetectors; smart pixels; 1 Tbit/s; InGaAs; InGaAs-based detectors; Tb/s aggregate data input/output; electro optical modulators; flip-chip bonded; free-space optics; hybrid very large scale integrated optoelectronics technology; optoelectronic crossbar switch design; optoelectronic crossbar switch fabrication; silicon integrated circuits; single chip; terabit per second free-space optical interconnect; Aggregates; Bonding; Detectors; Hybrid integrated circuits; Integrated circuit technology; Integrated optoelectronics; Optical modulation; Silicon; Switches; Very large scale integration;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/2944.778297

Filename

778297