DocumentCode :
1534409
Title :
Power, interface, and integration: handset chipset design issues
Author :
Tae Hee Han ; Yoo, Jae-Chern ; Lee, Hyunseok
Author_Institution :
Sungkyunkwan Univ., Suwon, South Korea
Volume :
47
Issue :
11
fYear :
2009
fDate :
11/1/2009 12:00:00 AM
Firstpage :
172
Lastpage :
179
Abstract :
In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax system-on-a-chip development.
Keywords :
mobile handsets; system-on-chip; chip-to-chip interface; handset chipset design; handset component technologies; mobile WiMax system-on-a-chip; mobile digital TV; mobile phone chipsets; mobile wireless terminal chipsets; power saving; third-generation cellular modems; CMOS process; CMOS technology; Circuit simulation; Energy consumption; Field programmable gate arrays; Integrated circuit technology; Modems; Silicon; System-on-a-chip; Telephone sets;
fLanguage :
English
Journal_Title :
Communications Magazine, IEEE
Publisher :
ieee
ISSN :
0163-6804
Type :
jour
DOI :
10.1109/MCOM.2009.5307482
Filename :
5307482
Link To Document :
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