• DocumentCode
    1534548
  • Title

    CMUT characterization by interferometric and electric measurements

  • Author

    Martinussen, Hanne ; Aksnes, Astrid ; Leirset, Erlend ; Engan, Helge E.

  • Author_Institution
    Dept. of Electron. & Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
  • Volume
    56
  • Issue
    12
  • fYear
    2009
  • fDate
    12/1/2009 12:00:00 AM
  • Firstpage
    2711
  • Lastpage
    2721
  • Abstract
    Capacitive micromachined ultrasonic transducers (CMUTs) with 5.7 ??m radius, realized by wafer bonding, have been characterized by both optical and electrical measurements. These measurements are performed by our heterodyne interferometer and a network analyzer, respectively. The results from this article will be used to improve the fabrication of next-generation CMUTs. We have investigated the spread in resonance frequency of different CMUT membranes along the array. Q-factors have been obtained using both measurement methods, and the results from the 2 methods have been numerically compared. The relation between applied dc voltage and resonance frequency has been studied. Temperature measurements show that increasing temperature leads to a small decrease in the resonance frequency of the CMUTs; however, the decrease is small enough to ensure stable operation with small variations in room temperature. The heterodyne interferometer is used to inspect the vibration pattern of the CMUTs´ higher harmonic modes. These modes are located at approximately 60 MHz in air. To the authors´ knowledge, vibration modes at frequencies >40 MHz have not been previously studied.
  • Keywords
    Q-factor measurement; acoustic variables measurement; capacitive sensors; light interferometry; micromachining; network analysers; ultrasonic transducers; wafer bonding; CMUT Q factor; CMUT characterisation; CMUT higher harmonic modes; CMUT membrane resonance frequency spread; CMUT resonance frequency; applied DC voltage; capacitive micromachined ultrasonic transducers; electric measurements; heterodyne interferometer; interferometric measurements; network analyzer; next generation CMUT fabrication; size 5.7 mum; temperature measurements; wafer bonding; Electric variables measurement; Optical interferometry; Optical mixing; Performance evaluation; Resonance; Resonant frequency; Temperature; Ultrasonic transducers; Ultrasonic variables measurement; Wafer bonding; Electric Capacitance; Electric Impedance; Equipment Failure Analysis; Interferometry; Micro-Electrical-Mechanical Systems; Transducers; Ultrasonography;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2009.1362
  • Filename
    5307503