DocumentCode
1534567
Title
Computing capacitances of vias in multilayered boards
Author
Alfonzetti, Salvatore ; Costamagna, Eugenio ; Fanni, Alessandra
Author_Institution
Dipartimento Elettrico Elettronico e Sistemistico, Catania Univ., Italy
Volume
37
Issue
5
fYear
2001
fDate
9/1/2001 12:00:00 AM
Firstpage
3186
Lastpage
3189
Abstract
The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Christoffel conformal mapping-finite difference procedure and the hybrid FEM/DBCI method. Different structures can be analyzed containing single or multiple ground planes, with finite or infinite thickness, with or without pads. Comparisons are made with other methods, showing that a greater accuracy is obtained by means of the two methods proposed
Keywords
capacitance; finite difference methods; finite element analysis; iterative methods; printed circuit design; Schwarz-Christoffel conformal mapping-finite difference procedure; capacitances; finite thickness; hybrid FEM/DBCI method; infinite thickness; multilayered boards; multiple ground planes; single ground planes; vias; Artificial neural networks; Boundary conditions; Capacitance measurement; Dielectrics; Electrostatic measurements; Finite element methods; Frequency; Geometry; Integral equations; Printed circuits;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.952573
Filename
952573
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