DocumentCode :
153462
Title :
In situ spectroscopic ellipsometry of SIS barrier formation
Author :
Cyberey, Michael E. ; Lichtenberger, Arthur W.
Author_Institution :
Univ. of Virginia Microfabrication Lab., Charlottesville, VA, USA
fYear :
2014
fDate :
14-19 Sept. 2014
Firstpage :
1
Lastpage :
2
Abstract :
First reported by our research group in 2007, AlN tunnel barriers grown by ICP nitridation of thin Al overlayers offer a promising alternative to Al oxide barriers for high current density SIS junctions used in quantum limited THz heterodyne receivers [1]. However, the growth rate of AlN is heavily dependent on ICP operating conditions and as new uncharacterized nitridation processes are investigated, knowledge of the barrier thickness is integral to realizing SIS junctions of desired current density, which is exponentially dependent upon barrier thickness. An in situ method for real time monitoring of ICP AlN growth on thin Al overlayers through the use of spectroscopic ellipsometry and a correlation of the determined AlN thickness to the normal resistance area product (RNA) of the resulting trilayer is reported.
Keywords :
aluminium; aluminium compounds; current density; ellipsometry; multilayers; nitridation; submillimetre wave receivers; Al; AlN; AlN tunnel barriers; ICP AlN growth; ICP nitridation; RNA; SIS barrier formation; SIS junctions; barrier thickness; current density; in situ spectroscopic ellipsometry; normal resistance area product; quantum limited THz heterodyne receivers; real time monitoring; thin Al overlayers; trilayer; uncharacterized nitridation; Films; III-V semiconductor materials; Integrated optics; Iterative closest point algorithm; Junctions; Niobium; RNA;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
Conference_Location :
Tucson, AZ
Type :
conf
DOI :
10.1109/IRMMW-THz.2014.6956458
Filename :
6956458
Link To Document :
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