DocumentCode
153462
Title
In situ spectroscopic ellipsometry of SIS barrier formation
Author
Cyberey, Michael E. ; Lichtenberger, Arthur W.
Author_Institution
Univ. of Virginia Microfabrication Lab., Charlottesville, VA, USA
fYear
2014
fDate
14-19 Sept. 2014
Firstpage
1
Lastpage
2
Abstract
First reported by our research group in 2007, AlN tunnel barriers grown by ICP nitridation of thin Al overlayers offer a promising alternative to Al oxide barriers for high current density SIS junctions used in quantum limited THz heterodyne receivers [1]. However, the growth rate of AlN is heavily dependent on ICP operating conditions and as new uncharacterized nitridation processes are investigated, knowledge of the barrier thickness is integral to realizing SIS junctions of desired current density, which is exponentially dependent upon barrier thickness. An in situ method for real time monitoring of ICP AlN growth on thin Al overlayers through the use of spectroscopic ellipsometry and a correlation of the determined AlN thickness to the normal resistance area product (RNA) of the resulting trilayer is reported.
Keywords
aluminium; aluminium compounds; current density; ellipsometry; multilayers; nitridation; submillimetre wave receivers; Al; AlN; AlN tunnel barriers; ICP AlN growth; ICP nitridation; RNA; SIS barrier formation; SIS junctions; barrier thickness; current density; in situ spectroscopic ellipsometry; normal resistance area product; quantum limited THz heterodyne receivers; real time monitoring; thin Al overlayers; trilayer; uncharacterized nitridation; Films; III-V semiconductor materials; Integrated optics; Iterative closest point algorithm; Junctions; Niobium; RNA;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
Conference_Location
Tucson, AZ
Type
conf
DOI
10.1109/IRMMW-THz.2014.6956458
Filename
6956458
Link To Document