• DocumentCode
    1535589
  • Title

    The implementation of a reduced-field profile design for high-performance bipolar transistors

  • Author

    Lu, Pong-Fei ; Comfort, James H. ; Tang, Denny D. ; Meyerson, B.S. ; Sun, J.Y.-C.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    11
  • Issue
    8
  • fYear
    1990
  • Firstpage
    336
  • Lastpage
    338
  • Abstract
    The first realization of a reduced-field design concept for advanced bipolar devices using the low-temperature epitaxial (LTE) technique to form the base layer is described. By inserting a lightly doped collector (LDC) spacer layer between the heavily doped base and collector regions, it is successfully demonstrated that the collector-base (CB) junction avalanche multiplication can be reduced substantially while maintaining high collector doping for current density consideration. Similar applications of the LDS technique to the emitter-base (EB) junction also results in a lower electric field, thus less EB junction reverse leakage. The feasibility of the reduced-field profile design concept is demonstrated using a LTE-base device structure.<>
  • Keywords
    bipolar transistors; doping profiles; vapour phase epitaxial growth; EB junction reverse leakage; base layer; bipolar devices; collector-base junction avalanche multiplication; current density; electric field; heavily doped base region; heavily doped collector region; high collector doping; high-performance bipolar transistors; lightly doped collector spacer layer; low temperature epitaxial technique; reduced-field profile design; Bipolar transistors; Boron; Breakdown voltage; Current density; Doping; P-n junctions; PIN photodiodes; Tail; Temperature; Thickness measurement;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.57926
  • Filename
    57926