• DocumentCode
    1537067
  • Title

    Modular testprocessor for VLSI chips and high-density PC boards

  • Author

    Budde, W.O.

  • Author_Institution
    Rheinisch Westfalischen Tech. Sch., Aachen, West Germany
  • Volume
    7
  • Issue
    10
  • fYear
    1988
  • fDate
    10/1/1988 12:00:00 AM
  • Firstpage
    1118
  • Lastpage
    1124
  • Abstract
    A method for the test of VLSI chips and high-density PC boards is proposed. A built-in, microprogrammable test controller, called a testprocessor, applied tests to all separately testable blocks within either a VLSI chip or PC board, hence increasing controllability and observability. Facilities for test-pattern storage and test-result evaluation as well as means for test-pattern generation and response compaction are provided; consequently, most tasks commonly associated with an external test equipment can be covered by the testprocessor. In contrast to most concepts of built-in test known to date, the testprocessor support tests of all kinds (structural, functional, pseudorandom), applied serially or in parallel; furthermore, adaptation to standardized test interfaces can easily be achieved. The concept is intended to simplify wafer test, production test, and testing burn-in, and it supports field maintenance and system self-test
  • Keywords
    VLSI; automatic testing; integrated circuit testing; printed circuit testing; VLSI chips; built-in test; controllability; field maintenance; functional; high-density PC boards; microprogrammable test controller; observability; production test; pseudorandom; response compaction; separately testable blocks; structural; system self-test; test-pattern storage; test-result evaluation; testing burn-in; testprocessor; wafer test; Delay; Design automation; Fault tolerance; LAN interconnection; Silicon; Switches; Testing; Tin; Very large scale integration; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.7811
  • Filename
    7811