• DocumentCode
    1537420
  • Title

    Nonlinear resistive electric field control for power electronic modules

  • Author

    Donzel, L. ; Schuderer, J.

  • Author_Institution
    ABB Corp. Res., Dattwil, Switzerland
  • Volume
    19
  • Issue
    3
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    955
  • Lastpage
    959
  • Abstract
    The trend towards increasing blocking voltage of high power Insulated Gate Bipolar Transistor (IGBT) modules is challenging for their electric insulation system. In particular, the electric field at the edges of the substrate metallization increases accordingly and can exceed the dielectric strength of the gel commonly used as encapsulation, leading to partial discharges or even breakdown of the insulation. This paper reports on the use of nonlinear resistive field grading to mitigate the electric field within power electronic modules. Finite element simulations show how the field enhancements can be significantly reduced by applying a functional coating with suitable nonlinear resistive characteristic. Coatings made of polyimide filled with ZnO microvaristors were manufactured and tested.
  • Keywords
    II-VI semiconductors; electric strength; electric variables control; encapsulation; finite element analysis; insulated gate bipolar transistors; nonlinear control systems; partial discharges; power electronics; zinc compounds; ZnO; dielectric strength; electric insulation system; encapsulation; finite element simulations; high power insulated gate bipolar transistor modules; microvaristors; nonlinear resistive electric field control; nonlinear resistive field grading; partial discharges; polyimide; power electronic modules; substrate metallization; Coatings; Electric fields; Metallization; Partial discharges; Polyimides; Substrates; Insulation; dielectric breakdown; electric field effects; finite element methods; insulated gate bipolar transistor module; nonlinear media; power electronics;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2012.6215099
  • Filename
    6215099