Title :
A Scaled Thermal-Diffusivity-Based 16 MHz Frequency Reference in 0.16 µm CMOS
Author :
Kashmiri, S. Mahdi ; Souri, Kamran ; Makinwa, Kofi A A
Author_Institution :
Texas Instrum., Delft, Netherlands
fDate :
7/1/2012 12:00:00 AM
Abstract :
This paper presents a 16 MHz frequency reference that exploits the well-defined thermal diffusivity of IC-grade silicon. After a room temperature trim, its absolute inaccuracy is ±0.1% from -55°C to 125°C (24 samples), while its cycle-to-cycle jitter is less than 45 ps (rms) at a power dissipation of 2.1 mW from a 1.8 V supply. The reference occupies 0.5 mm2 in a 0.16 μ m standard CMOS process. Compared to a previous design in an older 0.7 μm CMOS process, it achieves 10× higher frequency, 7× less jitter, 3.7× less power, and 12x less chip area, while maintaining the same level of accuracy.
Keywords :
CMOS integrated circuits; elemental semiconductors; jitter; silicon; IC-grade silicon; Si; cycle-to-cycle jitter; frequency 16 MHz; frequency reference; power 2.1 mW; power dissipation; scaled thermal-diffusivity; size 0.16 mum; size 0.7 mum; stan- dard CMOS process; temperature -55 degC to 125 degC; temperature 293 K to 298 K; voltage 1.8 V; Accuracy; Frequency locked loops; Heating; Jitter; Oscillators; Temperature; Temperature sensors; Band-gap temperature sensor; CMOS; DCO; digitally assisted; electrothermal frequency-locked loop; integrated frequency reference; scaled; thermal-diffusivity based;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2012.2191043