Physics-based CAD models for the analysis of vias in parallel-plate environments

Author

Abhari, Ramesh ; Eleftheriades, George V. ; Van Deventer-Perkins, Emilie

Author_Institution

Edward S. Rogers Sr. Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

Volume

49

Issue

10

fYear

2001

fDate

10/1/2001 12:00:00 AM

Firstpage

1697

Lastpage

1707

Abstract

In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radial transmission-line theory. The crosstalk power transferred by the TEM parallel-plate mode between vias is characterized, and extended to the treatment of vias in finite substrates by means of image theory. The presented CAD models can be combined with lumped and distributed circuit elements, as well as linear and nonlinear devices, providing an accurate and fast procedure for the global modeling of high-speed electronic circuits. The corresponding simulation time for representative single or multiple via configurations has been drastically reduced compared to full-wave simulations while maintaining comparable accuracy

Keywords

circuit CAD; circuit noise; circuit simulation; crosstalk; equivalent circuits; packaging; parallel plate waveguides; printed circuit design; TEM parallel-plate mode; buried vias; crosstalk power; distributed circuit elements; finite substrates; global modeling; high-speed electronic circuits; image theory; linear devices; lumped circuit elements; nonlinear devices; parallel-plate environments; physics-based CAD models; radial transmission-line theory; simulation time; through vias; via configurations; Analytical models; Circuit noise; Circuit simulation; Computational modeling; Concurrent computing; Crosstalk; Packaging; Performance analysis; Resonance; Transmission lines;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.954773

Filename

954773