High-Q LTCC-based passive library for wireless system-on-package (SOP) module development

Author

Sutono, Albert ; Heo, Deukhyoun ; Chen, Yi-Jan Emery ; Laskar, Joy

Author_Institution

RF Solutions Inc., Atlanta, GA, USA

Volume

49

Issue

10

fYear

2001

fDate

10/1/2001 12:00:00 AM

Firstpage

1715

Lastpage

1724

Abstract

In this paper, we present the development and full characterization and modeling of a multilayer ceramic-based system-on-package component library. Compact high-Q three-dimensional inductor and capacitor topologies have been chosen and incorporated. A measured inductor Q factor as high as 100 and self-resonant frequency as high as 8 GHz have been demonstrated. The new vertically interdigitated capacitor topology occupies nearly an order of magnitude less of real estate while demonstrating comparable performance to the conventional topology. The low-temperature co-fired ceramic (LTCC) library has been incorporated into a 1.9-GHz CMOS power-amplifier design exhibiting a measured 17-dB gain, 26-dBm output power, and 48% power added efficiency. This power-amplifier module with fully integrated LTCC passives demonstrates a superior performance to those with full and partial on-chip passive integration

Keywords

CMOS analogue integrated circuits; Q-factor; UHF integrated circuits; UHF power amplifiers; ceramic capacitors; ceramic packaging; inductors; integrated circuit packaging; 1.9 GHz; 17 dB; 48 percent; 8 GHz; CMOS power amplifier; Q-factor; inductor; multilayer low-temperature co-fired ceramic; passive library; self-resonant frequency; three-dimensional topology; vertically interdigitated capacitor; wireless system-on-package module; Capacitors; Ceramics; Frequency measurement; Inductors; Libraries; Nonhomogeneous media; Power measurement; Q factor; Q measurement; Topology;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.954775

Filename

954775