Development of a millimeter-wave system-on-a-package utilizing MCM integration

Author

Pham, A. ; Ramachandran, R. ; Laskar, J. ; Krishnamurthy, V. ; Bates, D. ; Marcinkewicz, W. ; Schmanski, B. ; Piacente, P. ; Sprinceanu, L.

Author_Institution

Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA

Volume

49

Issue

10

fYear

2001

fDate

10/1/2001 12:00:00 AM

Firstpage

1747

Lastpage

1749

Abstract

We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners

Keywords

integrated circuit packaging; millimetre wave integrated circuits; multichip modules; MCM integration; Wilkinson power combiner; digital ASIC; filter; integral passive device; microelectromechanical device; millimeter-wave system-on-a-package; multilayer polymer thin film; radiofrequency integrated circuit; thin film resistor; Application specific integrated circuits; Frequency; Integrated circuit packaging; Integrated circuit technology; Microelectromechanical devices; Millimeter wave integrated circuits; Millimeter wave technology; Nonhomogeneous media; Polymer films; Radiofrequency integrated circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.954779

Filename

954779