Title :
High-T/sub c/ superconductor oversampled delta modulator for analog-to-digital converters
Author :
Zhang, Y.M. ; Dubash, N. ; Ghoshal, U. ; Char, K.
Author_Institution :
Conductus Inc., Sunnyvale, CA, USA
fDate :
6/1/1997 12:00:00 AM
Abstract :
Based on a single-level YBCO thin film topology and seven bicrystal grain-boundary junctions, a high temperature superconductor delta modulator for analog-to-digital converters has been designed, fabricated, and tested. A single bit quantizer based on a quantum flux parametron (QFP) comparator is used for the modulator. A large superconducting inductor is used both for the signal input and for the feedback. A small resistor is chosen for connecting the comparator to the read-out section. The oversampling provides large input signal bandwidth with high dynamic range. Circuit simulations prove the concept of the design. The effective LSB and MSB of the modulator are discussed in terms of input inductance, junction critical current, and QFP noise current. The density of latched output pulses is proportional to the change of input amplitude. Au wires were employed to make crossover of bias lines. Although this modulator did not function as expected for low-speed measurements, it shows the proper latching behaviour of the output section at 4.2 K and 35 K.
Keywords :
analogue-digital conversion; barium compounds; delta modulation; high-temperature superconductors; superconducting integrated circuits; yttrium compounds; 35 K; 4.2 K; Au wire; LSB; MSB; YBCO thin film; YBaCuO-Au; analog-to-digital converter; bicrystal grain-boundary junction; circuit simulation; feedback; high temperature superconductor delta modulator; latching; oversampling; quantizer; quantum flux parametron comparator; superconducting inductor; Analog-digital conversion; Delta modulation; Electronics packaging; High temperature superconductors; Josephson junctions; Superconducting thin films; Testing; Thin film inductors; Topology; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on