Title :
Compressed Passive Macromodeling
Author :
Olivadese, Salvatore Bernardo ; Grivet-Talocia, Stefano
Author_Institution :
Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
Abstract :
This paper presents an approach for the extraction of passive macromodels of large-scale interconnects from their frequency-domain scattering responses. Here, large scale is intended both in terms of number of electrical ports and required dynamic model order. For such structures, standard approaches based on rational approximation via vector fitting and passivity enforcement via model perturbation may fail because of excessive computational requirements, both in terms of memory size and runtime. Our approach addresses this complexity by first reducing the redundancy in the raw scattering responses through a projection and approximation process based on a truncated singular value decomposition. Then we formulate a compressed rational fitting and passivity enforcement framework which is able to obtain speedup factors up to 2 and 3 orders of magnitude with respect to standard approaches, with full control over the approximation errors. Numerical results on a large set of benchmark cases demonstrate the effectiveness of the proposed technique.
Keywords :
S-parameters; approximation theory; frequency-domain analysis; interconnections; singular value decomposition; approximation errors; compressed passive macromodeling extraction; compressed rational fitting; dynamic model order; electrical ports; frequency-domain scattering responses; large-scale interconnects; passivity enforcement framework; passivity enforcement via model perturbation; rational approximation process; truncated singular value decomposition; vector fitting; Approximation methods; Computational modeling; Couplings; IP networks; Scattering; Standards; Vectors; Interconnects; linear matrix inequalities; macromodeling; passivity; scattering parameters; singular value decomposition vector fitting;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2199320